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NTLJF4156N
Power MOSFET and
Schottky Diode
30 V, 4.6 A, m Cool ] N?Channel, with
2.0 A Schottky Barrier Diode, 2x2 mm
WDFN Package
http://onsemi.com
Features
? WDFN Package Provides Exposed Drain Pad for Excellent Thermal
V (BR)DSS
MOSFET
R DS(on) MAX
I D MAX (Note 1)
?
?
?
?
?
Conduction
Co?Packaged MOSFET and Schottky For Easy Circuit Layout
R DS(on) Rated at Low V GS(on) Levels, V GS = 1.5 V
Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
Low V F Schottky
This is a Pb?Free Device
30 V
70 m W @ 4.5 V
90 m W @ 2.5 V
125 m W @ 1.8 V
250 m W @ 1.5 V
SCHOTTKY DIODE
4.6 A
Applications
? DC?DC Converters
? Li?Ion Battery Applications in Cell Phones, PDA’s, Media Players
? Color Display and Camera Flash Regulators
V R MAX
30 V
D
V F TYP
0.47 V
A
I F MAX
2.0 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain?to?Source Voltage
Symbol
V DSS
Value
30
Unit
V
G
Gate?to?Source Voltage
V GS
± 8.0
V
S
K
Continuous Drain
Current (Note 1)
Steady
State
T J = 25 ° C
T J = 85 ° C
I D
3.7
2.7
A
N?CHANNEL MOSFET
SCHOTTKY DIODE
MARKING
t ≤ 5s
T J = 25 ° C
4.6
DIAGRAM
G
Power Dissipation
(Note 1)
Steady
State
t ≤ 5s
T J = 25 ° C
P D
1.5
2.3
W
1
WDFN6
CASE 506AN
1 6
2 JLM G 5
3 4
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T J = 25 ° C
T J = 85 ° C
T J = 25 ° C
I D
P D
2.5
1.8
0.71
A
JL = Specific Device Code
M = Date Code
G = Pb?Free Package
(Note: Microdot may be in either location)
Pulsed Drain Current
t p = 10 m s
I DM
20
A
PIN CONNECTIONS
Operating Junction and Storage Temperature
T J , T STG
?55 to
° C
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I S
T L
150
2.4
260
A
° C
A
N/C
1
2
K
6
5
K
G
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
D
3
D
4
S
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm 2 , 2 oz. Cu.
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
? Semiconductor Components Industries, LLC, 2006
June, 2006 ? Rev. 4
1
Publication Order Number:
NTLJF4156N/D
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